| Density |
Standard |
Advanced |
12-18 months |
| Minimum Line/Spacing, Internal |
3/3 |
3/3 |
2.5/3 |
| Minimum Line/Spacing, External |
4/4 |
3/3 |
3/3 |
| Minimum Drilled Hole Size |
8 |
6 |
6 |
| Aspect Ratio (Thickness to Drill) |
10:1 |
15:1 |
18:1 |
| Land Size (Diameter over Drill) |
10 |
8 |
6 |
| Anti-pad (Diameter over Drill) |
20 |
16 |
15 |
| Plated Hole Tolerance |
+/- 3 |
+/- 2 |
+/- 2 |
| Minimum Dielectric Thickness |
3 |
2 |
<1 |
| Maximum PCB Thickness (inches) |
0.200 |
0.250 |
0.300 |
| Thickness Tolerance
(% of Thickness) |
+/- 10 |
+/- 7 |
+/- 5 |
| Maximum PCB Dimensions (inches) |
16.2 X 22.2 |
22.2 X 26.2 |
22.2 X 26.2 |
| Fabricated Dimensions
- NC Routing |
+/- 5 |
+/- 3 Vision |
+/- 2
Vision |
| Layer-to-Layer Registration Tolerance |
+/- 5 |
+/- 4 |
+/- 3 |
| Solder Mask Clearance, Per Side |
2.5 |
2 |
<2 |
| Blind/Buried Vias(All Types) |
X |
X |
X |
| Via Fill(Conductive, Non-Conductive) |
x |
X |
X |
