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Component Library Development and Maintenance
- Dedicated development Team
- Process driven development
- Symbols compliant with IEEE and with IPC-7351 standards
- Customised library development for different customers
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Printed Circuit Board Layout
- High Speed digital, Analog, Mixed and RF designs
- High Density PCBs : > 500 pins / Sq.inch
- High Layer count boards : 20+ layers
- High Speed Interconnects : 3.125 Gbps
- Impedance/Delay matching
- Blind and Buried Vias
- Fine Pitch BGA (0.5mm), High Pin count BGA (1764 pins)
- Motherboards, High Speed Serial Backplanes, Single board computers
- ASIC Evaluation boards, Probe Cards
- Mechanically constrained PCBs
- Expertise on Mentor Graphics and Cadence tools
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Signal Integrity & High Speed Board Design
- Simulation using Eldo Spice and IBIS Models
- Eye Pattern & Jitter analysis for multi-gigabit signals
- Analysis of High Speed SERDES based designs
- Multi-board system level simulation
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Board level Thermal analysis
- Power Dissipation
- Thermal Gradient
- Thermal Distribution
- Detection & correction of hot-spots
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